Whisker Evaluation for Sn (tin) alloy plating
in electric components
We conduct tests accordingly to the Fujitsu Standards for whisker evaluation, to evaluate for the whisker growth by means of optical microscope.
What is Whisker?
Wire-shape structures grown from metal surface.
It is known that proper-whisker (whisker consists of single crystal same with that of base material constituent) grows on
the Sn deposits plated on surface.
Non-proper-whisker refers to the whisker that grows with chemical reactions; e.g. silver sulfide, cupper oxide.
Optional evaluation
Upon your request, following services are available.
- Measuring maximum length of whisker
- Cross section sampling and observation of whisker foot by means of FIB.
- Element distribution analysis by means of SEM-EDX
Fujitsu Group Whisker evaluation standards
Fujitsu Whisker evalluation standards is now under reviewing.
The revised version will be disclosed in Februaly, 2007.
If you need to refer to the Standards as soon as possible, please contact us.
Thank you for the patience.
Whisker growth
Before test stress
After 60 days exposure to ambient temperature
Short between terminals due to whisker
Whisker observation
Whisker in FFC (Flexible Flat Cable) connector.
Magnified image of terminal
Magnified image of Whisker (about 60µm in length)
Cross section for Whisker observation
Surface observation
Cross section observation