PCB analysis for RoHS compliance

We analyze PCB (Printed Circuit Board) unit for RoHS compliance without destroying PCB unit, by utilizing element mapping technique by means of fluorescence X-ray.

What is RoHS?

Direction issued by EU. In the direction, "6 hazardous materials": Cadmium, Lead, Mercury, Hexavalent Chromium, Bromine kind flame retardant (PBB: Polybrominated biphenyl, PBDE: Polybrominated diphenyl ether) are specified, and the usage of relevant material in electrical appliances are banned starting from 2006 July.

What is RoHS abbreviated from?

"Restriction of Use of Certain Hazardous Substances in Electrical and Electric Equipment"

Analysis Subject

PCB unit claimed as “RoHS compliance” by vendor.

Analysis Objective

Identify vendor's latent problem in component procurement or manufacturing control.
If problems are detected, require vendors for corrective actions such as control system improvement.

*Note: In the case that analysis subject includes area invisible from surface (such as Solder ball on BGA), destructive test is additionally required.

PCB unit Analysis steps

Analysis for lead in Solder (plating).
1. Obtain mapping of 5 elements + main elements by scanning florescence X-ray analysis
2. Through Sn-Pb coexistence judgment, presume the presence of Pb in terminal plating
3. Based on presumption above, conduct fixed-point composition analysis of suspicious terminal, to confirm lead presence.
4. Confirm the composition of solder paste (3 flows/ 3 reflows)
Suspicious area other than solder area
1. Identify the suspicious area (Unless otherwise specified in drawings, Fujitsu Quality Laboratory ltd will specify based on the experience.)
2. Conduct Florescence X-ray analysis of suspicious area
Necessity of additional investigation
1. Consider necessity of additional analysis (such as chemical analysis), or necessity of confirmation with vendor (manufacturer).