Failure Analysis Service
Based on technology and knowledge accumulated through our long-term experience in reliability evaluation and failure analysis in Fujitsu Limited, we serve as an adviser for your failure mechanism investigation, prediction of failure impact and countermeasure development.
Failure Analysis Example
Crack: Electric component (Cross section observation)
Crack: Chip ceramic capacitor (Cross section)
BGA (Solder crack, Cross section)
Layer separation: PCB (Cross section)
Missing Solder ball in BGA (X-ray)
Delamination in LSI Insulation layer
(Tomographic image taken by C-Mode Scanning Acoustic Microscope)
Equipment
SEM-EDX
Scanning electron microscope
– Energy dissipation type X-ray analyzer
Emission Microscope
Identify location of leakage within IC
Scanning Acoustic Microscope
Observation of delamination within mold package
Plastic mold opener
De-capsulation of mold packaged IC to take out the chips inside.
