Reliability Evaluation

Supported by the technology and the knowledge accumulated through our long-term experience in reliability evaluation and failure analysis in Fujitsu Limited, we may help you in resolving the quality problem in the component or the module, through the laboratory service for reliability evaluation.
Do not hesitate to consult us, for the test conditions including the voltage bias, or the parameter monitoring. We also have the consulting service, e.g. for the reliability evaluation test menu and estimation of the product life, the failure rate, and the quality variation in the production.

Reliability Test

Environment test

• Damp-heat cycle test (Moisture resistance test)
• Temperature cycle test (Thermal shock test)
• Solder heat resistance test
• Migration test (Insulation test)
• Damp Heat Biased test (THB)
  THB is an accelerated test to verify the resin-sealed device for its moisture resistance. Failure induced by moisture such as corrosion, contamination on surface or deterioration in contact can be detected in THB. Test condition of 85 degC, 85%RH, under rated voltage at power supply, for 1000 hours (JESD22-A101, etc), is generally applied to test semiconductor devices.
• Highly Accelerated Stress testing (HAST)
  HAST test is a damp heat bias test and has another name “unsaturated pressure cooker test”. Applying test conditions of high temperature no less than 100 degC and high pressure no less than 1 hPa, HAST is very effective accelerated test to evaluate the device for its moisture resistance within short period of time. Test condition of 120 degC, 85%RH (1.7 hPa), under rated voltage at power supply, for 200-400 hours is generally applied to test semiconductor devices.
• Pressure Cooker Test (PCT)
  PCT is similar to HAST test in testing moisture resistance applying test conditions of high temperature no less than 100 degC and high pressure no less than 1 hPa. Difference from HSAT is that humidity condition in PCT is no less than 100%RH and there is no voltage bias during the test. While HAST is called unsaturated pressure cooker test, PCT sometimes called “saturated pressure cooker storage test”. This test method is suitable to evaluate resin sealed device for its thermal resistance in reflow, and crack in resin caused by heat application during the reflow can be detected within short period of time. 121 degC, 100%RH (2hPa) for 48-96 hours are general test conditions.
• Gas test
• Weathering test

Failure analysis /evaluation

• Identification of the defect point
  ---Emission microscope, etc
• Whisker evaluation

Mechanical test

• Vibration test

Reliability test method

The failures detected in the reliability evaluation