Material Course
These tables introduce you details of analysis and analysis method suitable for your material or failure phenomena.
| Material | ||||
|---|---|---|---|---|
| Material | Location | Analyze for | Objective | Equipment |
| Sealing material Adhesive |
Chief constituent | Description | Specification establishment, Lot control | Heat decomposition GC-MS, FT-IR |
| Additive | Heat decomposition GC-MS | |||
| Phosphorous | Acceptability judgment before purchasing | ICP-AES | ||
| Ion constituent (chlorine, bromine) | IC | |||
| Filler | Amount | Specification establishment, Lot control | TG-DTA | |
| Description | EPMA | |||
| Hardening material | Description/amount of heat induced gas | Influence on ambient environment Lot Control |
TCT-GC-MS | |
| Contained ion | Corrosion/Pollution investigation | IC | ||
| Heat resistance | Selecting material type | TG-DTA | ||
| Hardening level | Optimization of hardening condition | DSC | ||
| Ceramic for package | Ceramic material | Chief constituent element | Specification establishment, Lot control | EPMA |
| Impurity element | ICP-AES | |||
| Electrode | Chief constituent element | EPMA | ||
| Impurity element | EPMA | |||
| Wire bonding material |
Gold wire | Impurity element | ICP-AES | |
| Lead frame | Chief constituent element | EPMA | ||
| Impurity element | ICP-AES | |||
| Bump | Chief constituent element | EPMA | ||
| Impurity element | ICP-AES | |||
| Contamination ion constituent | Leakage prevention | IC | ||
| PCB raw material |
Cupper foil | Impurity | Lot control | ICP-AES |
| Resist | Resin constituent | FT-IR | ||
| Solvent constituent | GC-MS | |||
| Description of impurity element | EPMA | |||
| Amount of impurity element | ICP-AES | |||
| Board material | Cross section configuration Via configuration |
OM,SEM | ||
| Pad area | Plating thickness | Optimization of conditions, Lot Control | OM,TEM, FE-SEM |
|
| Diffusion of plating layer | FIB,FE-SEM | |||
| Segregation in plating layer | FE-SEM-EDX | |||
| Solder kinds | Metallic area | Alloy composition | Lot Control | EPMA |
| Impurity element | ICP-AES | |||
| Melting-point measurement | DSC | |||
| Flux area | Organic constituent | FT-IR | ||
| Solvent constituent | GC-MS | |||
| Cleaning solvent | Impurity element | ICP-AES | ||
| Organic constituent | FT-IR, GC-MS |
|||
| Solder bath | Constitution of Metal composition in solvent | Quality Control | ICP-AES | |
| Failure phenomenon | ||||
|---|---|---|---|---|
| Phenomenon | Component/Material | Location | Analysis | Equipment |
| Electric Short, Open |
PCB | Trace area | Shape of surface corrosion, element analysis | EPMA |
| Migration between traces | ||||
| Residual foreign material | ||||
| LSI package | Adjacent bump | v | FIB-SIM | |
| Conductive defect | PCB, LSI package, etc |
Solder junction area | Shape observation | SEM |
| Constituent distribution on cross section | EPMA | |||
| Pad cross section | Crack shape observation, Foreign material constitution | SAM | ||
| Lead terminal | Surface contamination/degraded layer | SAM,XPS | ||
| Separation (Peel off) |
LSI package | Solder bump junction area | Constituent distribution on cross section | EPMA,SAM |
| Lamination film | Depth profile | SAM | ||
| Separated Bonding area | Condition of alloy layer formation Foreign material |
EPMA | ||
| Body | Painting | Foreign material on peel-off area | XPS | |
| Leakage | PCB | Pad | Surface condition | XPS |
| Foreign material, Oxidation film thickness | SAM | |||
| Bonding | LSI package | Bonding Pad | Surface constituent Thickness of degraded layer | SAM |
| Discoloration | PCB | Electrode | By-product constituent | EPMA,SAM |
| Identification of organic foreign material | FT-IR,XPS | |||
| Thin film, etc | Metal, Resin surface | Chemical bonding condition | XPS | |