FUJITSU QUALITY LABORATORY

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Environment Course

In Environment course, objectives of analysis services are classified into two aspects: "ambient environment" and "environmental factors". "Ambient environment" includes computer room or warehouse, or solution of sick house phenomena, while "environmental factors" includes analysis for toxic substance that influences on environment.

Ambient Environment
Place Influence on Target Analyze for Equipment
Installation room Large-scale computer Corrosive constituent
(Dust)
Adequacy for installation EPMA
Corrosive constituent
(Deposit)
State of pollution due to powder fire extinguisher
Corrosive gas density
(Short term)
Adequacy for installation IC
Corrosive gas density
(long term)
Eco checker
Laptop PC Corrosive constituent
(Dust)
State of pollution due to volcanic ash EPMA,IC
Storage Warehouse Corrosive Gas density
(long term)
Adequacy for storage Eco checker
Production clean room Metal Type/Amount of corrosive constituent Influence of process environment XPS,SAM
LSI Corrosive gas density
(Short term)
Influence from ambient environment IC
Organic constituent GC-MS
Corrosive gas density
(long term)
Control on ambient environment Eco checker
Storage container Cupper film Type/Amount of corrosive constituent Influence of pollution within container XPS,SAM
School classroom Students Control substance for "Sick house" Judge compliance with requirements in School environmental hygiene Liquid chromatography, GC-MS
Office Employee Formaldehyde density Judge compliance with requirements in Criteria in guideline published by Ministry of Health Liquid chromatography
Influence on Environment
Product
Component
Location Target Analyze for Equipment
Laptop PC
Body Type of flame retardan Halogen free flame retardant usage condition EPMA
Solder Constitution Lead free solder usage condition
Cable Presence of phthalate ester (elasticizer) Environmental hormonal constituent contained or not FT-IR,GC-MS
Display Resin pellet
Amount of Lead/Cadmium contained Judgment on acceptability ICP-AES
Mobile phone Solder Constitution Lead free solder usage condition EPMA
Ink
Adhesive
Ingredient contained Amount of Lead/Cadmium contained Judgment on acceptability ICP-AES