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Component Course
The table explains appropriate analysis for each component type.
| Component | Location | Analyze for | Objective | Equipment |
|---|---|---|---|---|
| Magnetic Head | Elemental Device | Shape of Cross section | Judgment on Process Acceptability | FIB-SIM,TEM |
| Configuration Analysis | TEM | |||
| Analysis of insulation defect | TEM | |||
| ESD breakdown | Analysis on resistance defect | FE-SEM | ||
| Magnetic Pole | Dimension | Judgment on Process Acceptability | FIB-SIM, FE-SEM |
|
| Microscopic line lithography | Pre conditioning for process verification | FIB | ||
| Shape of Cross section | Process verification | TEM | ||
| SAW filter | Electrode | Constituent element of each layer | Evaluation on purchased article | SAM |
| Shape of Cross section | FIB-SIM, FE-SEM |
|||
| Shape of Surface/Cross section | Lot control | |||
| Shape of crystal grain | Define Process conditions | TEM | ||
| Area of foreign material contamination | Element analysis | Identification of origin of foreign material | EPMA | |
| Pad Surface | State of diffusion | Investigation for material and process | SAM | |
| Display component |
ITO film | Shape of crystal grain | Observation of crystal development | FE-SEM |
| Surface after completion of each process | Root cause analysis for degradation in characteristics | XPS | ||
| EL device | Film thickness, Shift in pixel, pattern |
Judgment on Process Acceptability | FIB-SIM, FE-SEM |
|
| Optical device | Lens | Microscopic surface configuration, roughness | Influence on device characteristics | AFM |
| Mirror surface film | Blaster, Peel off | Evaluation on purchased article | SEM | |
| Mirror ground film | Description of Element | EPMA | ||
| Cross section of Antireflection film | Constituent of thin film, Film thickness | Root cause analysis for abnormal characteristics | SAM | |
| Fiber terminal cross section |
Constituent element of contamination | Root cause analysis for degradation in characteristics | ||
| Organic foreign substance | XPS | |||
| Crystal configuration of Coating film |
Root cause analysis for white turbidity | TEM | ||
| Cross section of damaged surface | Root cause analysis for abnormal output | FIB-SIM | ||
| Metallic area | Constituent of Rust | Root cause analysis for corrosion | XPS | |
| Plastic component |
Cross section of Mold material |
Presence of Inorganic phosphorous | Judgment on acceptability | EPMA |
| Connector | Housing | Quality of Material | Lot control | FT-IR,GC-MS |
| Filler amount | TG/DTA | |||
| PCB | Surface trace | Constituent of Foreign material | Root cause analysis for foreign material contamination | EPMA |
| Shape, Element analysis | Root cause analysis for electrical short | |||
| Resist | Resin Constituent | Lot control | FT-IR | |
| Solvent constitution | GC-MS | |||
| Description of impurity element | EPMA | |||
| Amount of Impurity element | ICP-AES | |||
| Quality of foreign material | Root cause analysis for foreign material contamination | FT-IR | ||
| Cross section of Pad area | Plating thickness | Lot control | OM,TEM, FE-SEM |
|
| State of diffusion of plating layer/segregation |
FE-SEM-EDX |