Analysis Example

For more details, please visit "Test equipment" page.

Field Emission-Scanning Electron Microscope (FE-SEM)

Configuration observation at high resolution
Microscopic pattern observation at high resolution

Focused Ion Beam System (FIB)

Cross section of electrode pad
Cross section of non-volatile memory
Cross section of interface between multi layer thin film and solder

Electron Probe X-ray Micro Analyzer (EPMA)

Analysis of foreign material appears on ditch bottom of the trace
Electric short defect due to corrosion in IC lead mounted on the PCB
Electric short defect due to migration in solder constituent
Two dimensional density mapping analysis of cross section of solder joint area

Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP-AES)

Analysis of impurity eluted in solder bath

Ion Chromatography (IC)

Root cause analysis for tarnish in optical reflection mirror
Electrode corrosion due to residual chlorine ion in silicone resin

Transmission Electron Microscope (TEM)

Cross section observation on Cu-via
Cross section observation on High-dielectric-constant insulation film (Ta2O5)MOS configuration

Auger Electron Spectroscopy (SAM)

Element analysis of abnormal area in metal surface
Element distribution in contaminated trace surface
Depth direction analysis of solder bump surface
Surface / Line analysis on solder bump cross section
Analysis of interface processed with Microcapsule-style anisotropic conductive adhesive.

X-ray Photoelectron Spectroscopy (XPS)

Analysis of painting peel-off defect in plastic component
Analysis of residual resist on metal spatter film surface

Fourier Transform Infrared Spectrophotometer (FT-IR)

Foreign material Analysis on memory module
Measuring composition rate of ABS resin.

Gas Chromatography-Mass Spectrometer (GC-MS)

Organic compound Analysis in clean room ambient environment
Quantitative/Qualitative analysis of organic compound adsorbed on wafer

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