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FUJITSU QUALITY LABORATORY

Japan

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Analysis Example

For more details, please visit "Test equipment" page.

Field Emission-Scanning Electron Microscope (FE-SEM)

  • Configuration observation at high resolution
  • Microscopic pattern observation at high resolution

Focused Ion Beam System (FIB)

  • Cross section of electrode pad
  • Cross section of non-volatile memory
  • Cross section of interface between multi layer thin film and solder

Electron Probe X-ray Micro Analyzer (EPMA)

  • Analysis of foreign material appears on ditch bottom of the trace
  • Electric short defect due to corrosion in IC lead mounted on the PCB
  • Electric short defect due to migration in solder constituent
  • Two dimensional density mapping analysis of cross section of solder joint area

Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP-AES)

  • Analysis of impurity eluted in solder bath

Ion Chromatography (IC)

  • Root cause analysis for tarnish in optical reflection mirror
  • Electrode corrosion due to residual chlorine ion in silicone resin

Transmission Electron Microscope (TEM)

  • Cross section observation on Cu-via
  • Cross section observation on High-dielectric-constant insulation film (Ta2O5)MOS configuration

Auger Electron Spectroscopy (SAM)

  • Element analysis of abnormal area in metal surface
  • Element distribution in contaminated trace surface
  • Depth direction analysis of solder bump surface
  • Surface / Line analysis on solder bump cross section
  • Analysis of interface processed with Microcapsule-style anisotropic conductive adhesive.

X-ray Photoelectron Spectroscopy (XPS)

  • Analysis of painting peel-off defect in plastic component
  • Analysis of residual resist on metal spatter film surface

Fourier Transform Infrared Spectrophotometer (FT-IR)

  • Foreign material Analysis on memory module
  • Measuring composition rate of ABS resin.

Gas Chromatography-Mass Spectrometer (GC-MS)

  • Organic compound Analysis in clean room ambient environment
  • Quantitative/Qualitative analysis of organic compound adsorbed on wafer

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