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Application System Course
Taking several applications as example, the table explains analysis conducted for each type of problem.
| Application | Location | Analyze for | Objective | Equipment |
|---|---|---|---|---|
| Mobile Phone, etc | Optical waveguide | Composition of foreign material | Root cause identification of Foreign material contamination | EPMA |
| PCB trace |
Condition of Foreign material Composition of Foreign material |
Root cause identification of Electrical Short | ||
| Flat cable |
Condition of disconnection (breakage) |
Root cause identification of breakage | OM,SEM | |
| Body surface | Composition of surface contamination | Root cause identification of Painting peel-off | XPS | |
| Charging terminal | Shape | Root cause identification of Contact defect | SEM | |
| Element composition of Foreign material | EPMA,SAM | |||
| Identification of Organic Foreign material adhered | FT-IR,XPS | |||
| Laptop PC |
Connector | Shape of Solder joint area | Estimation of cause of breakage | SEM |
| Observation /analysis of joint area | Root cause identification of conductive defect | EPMA | ||
| Body surface | Invisible foreign material contamination | Root cause identification of Sticker peel-off | XPS | |
| Hard Disk |
Head area cross section |
Composition of abnormal area in structure | Root cause identification of Resistance defect | SAM |
| Cushion material | Contained Ion | Judgment on serviceability (As a head crush prevention) |
IC | |
| Organic gas thermally generated | GC-MS | |||
| Medium contamination risk | XPS | |||
| Plastic component |
Material quality | Main constituent resin control | FT-IR | |
| Filler control | TG/DTA,EPMA | |||
| Organic additive control | FT-IR,GC-MS | |||
| Optical Disk | Metal pin | Shape of broken surface | Root cause identification of breakage | SEM |
| Mirror | Foreign material contamination | Root cause identification of contamination | FT-IR,EPMA | |
| Printer | Removal lever |
Shape of broken surface | Root cause identification of breakage | SEM |
| Printing section | Composition analysis of Ink constituent | Printing ink constituent | FT-IR | |
| Element analysis on printing blot | Root cause identification of printing bolt | EPMA |