Assembly anormity
Soldering
In the surface mounting process of the components onto the PWB, the solder is generally used. There is increasing requirements in the soldering technology, due to the demands in the higher density assembly or Pb-free solder for the RoHS compliance. The electronic manufactures often face to the unexpected failure in their products when they apply the new material, or new technology.
FQL support your company to solve the problems related to the solder, through the combination of analysis methods, and our long-time involvement in the failure analysis.
Microsection on solder interface - FIB
FIB (Focused Ion Beam) can make cross section of the specimen and also provide the microsection image. This feature reduce the time required for the analysis, and provides what we want to observe effectively.
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Micro section of Solder interface - CP
CP (Cross-section polisher) is tle polishing technology that can polish larger area, hardly damaging the specimen. Thanks to this feature, CP is suitable for making microsection of the specimen that include sensitive material such as solder.
SEM (Scanning Electron Microscope) image obtained by CP.
Micro section of Solder interface - TEM-EDX
TEM (Transmission Electron Microscope) -EDX (Energy Dispersive X-ray spectroscopy) can analyze the structure of the interface and the element composition.
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Surface of the solder bump - AES
By AES (Auger Electron Spectroscopy) , element composition and distribution can be analyzed. AES features with the sputter etching function that realize the element analysis in the depth direction.
SEM image, showing the analyzed spot.
Spectrum of OK device, in depth direction
Spectrum of NG device (conductive failure), in depth direction
In the surface of the solder bump of the IC package, which belongs to the production lot in which NG device (conductive failure) belonged, we found thicker oxidization film and more carbon and natrium than that of OK device..