Advantages

Taking advantages of the various analysis methods and our know-how, we can provide you the approach to solve the problem tha you face with.

RoHS compliance

Feel free to contact us if you have inquiry such as "analyze a hole module" "analyze the plating film only" or "Analyze effectively within the limited budget".

Environment

The corrosive gas that surrounds the system may cause the failure in system operation. To prevent the risk of this kind, we suggest simple environment check.

Conductive / Insulation defect

We analyze the printed wiring board, connectors, or IC for the root cause of the conductive / insulation defect (open / short); which can be foreign material inclusion, migration, fretting corrosion.

Adhesive

Our expert in adhesive related failure can respond to your problem. We can also respond to your inquiry such as the characteristic analysis of the adhesive or providing the bench mark on the adhesives commercially available.

Anormaly of assembly

Through the combination of analysis methods supported by our experience and knowledge, we can support you to solve the problem in the materials, which is used in the assembly process of the electronic devices.

Device with Metallic thin film technology

We are highly skilled in the analysis on the structure of the metaric thin film, for the element, layer thickness and so on.