Taking advantages of the various analysis methods and our know-how, we can provide you the approach to solve the problem tha you face with.
Feel free to contact us if you have inquiry such as "analyze a hole module" "analyze the plating film only" or "Analyze effectively within the limited budget".
The corrosive gas that surrounds the system may cause the failure in system operation. To prevent the risk of this kind, we suggest simple environment check.
We analyze the printed wiring board, connectors, or IC for the root cause of the conductive / insulation defect (open / short); which can be foreign material inclusion, migration, fretting corrosion.
Our expert in adhesive related failure can respond to your problem. We can also respond to your inquiry such as the characteristic analysis of the adhesive or providing the bench mark on the adhesives commercially available.
Through the combination of analysis methods supported by our experience and knowledge, we can support you to solve the problem in the materials, which is used in the assembly process of the electronic devices.
We are highly skilled in the analysis on the structure of the metaric thin film, for the element, layer thickness and so on.