Notice Regarding Impact of Earthquake in Iwate Region of Japan

Tokyo, July 25, 2008 - As a result of the earthquake that struck the Iwate region after midnight on July 24, 2008, a portion of the semiconductor manufacturing equipment at Fujitsu Microelectronics' Iwate Plant was damaged.

Immediately after the earthquake, the company established response teams (headed by company President Haruki Okada) at its Akiruno Technology Center and the Iwate Plant to gather information on the safety of its employees, determine the scope of damage to the facilities and implement response measures. The company continues to make every effort to minimize the effect of the damage on its customers.

[Employee Safety and Extent of Damage]
The company has confirmed the safety of all plant employees, while inspections have found that there was no structural damage to the plant infrastructure, including its power, water and transportation facilities. A portion of the equipment used in front-end semiconductor manufacturing processes, however, was damaged.

[Status of Plant Operation]
Wafer testing and subsequent processes were resumed the morning of July 24. The company continues to make every effort toward resuming all front-end manufacturing processes as soon as possible. At the current time, however, the company expects that several days of further inspections will be necessary before it can estimate when normal operations will resume.