Fujitsu Microelectronics Launches Mobile WiMAX Chipsets for Mobile Devices

- Designed to fit in WiMAX modules sized 12 x 12mm, features standby current of less than 0.5mA -

Next-generation Mobile WiMAX technology will be deployed in the United States, Europe, and Taiwan this year, and in Japan next year. The initial service will be through PC-based mobile broadband access, with simultaneous development of handsets, smart phones, PDAs, portable games and navigation systems.

The chipset's mature software stacks have been proven in the previous generation product, and the power management schemes have been optimized at the system level. These factors enable mobile WiMAX terminal manufacturers to focus on designing attractive user interfaces and service-oriented applications.

"This highly integrated WiMAX chipset features the low power and small form factor essential to the development of attractive mobile WiMAX terminal products," said Makoto Awaga, General Manager of the Mobile Solution Business Group of Fujitsu Microelectronics Limited in Japan. "Fujitsu Microelectronics has assumed a global leadership position in moving WiMAX into deployment, and we are now ready to work with module vendors to meet market requirements."

Chipset Key Features

The MB86K22 is a fully integrated baseband LSI built using Fujitsu Microelectronics' 65nm advanced CMOS low-leakage process technology. The operating power of the MB86K22 has been reduced by 36 percent from the previous generation. Power-gating technology shuts down the power supply in the unused blocks inside the device, so that the entire mobile WiMAX module consumes only 0.5mA, thereby extending battery life.

The MB86K52 is an RF LSI built using CMOS process technology, which supports 2.3GHz, 2.5GHz, and 3.5GHz, almost all the frequencies set by the WiMAX Forum. This offers mobile WiMAX terminal manufacturers the ability to introduce global WiMAX devices. The MB86K52 also supports MIMO and beamforming technology, which is essential for mobile WiMAX Wave 2.

The MB39C316 power management LSI eliminates all the complex and time-consuming power management requirements by accommodating one cell battery. This design minimizes the peripheral components outside of the module. The MB39C316 controls and manages the module's power schemes at the system level, achieving the lowest power consumption at each operation.

Sample Availability and Pricing

Samples of Fujitsu Microelectronics' Mobile WiMAX chipset will be available in August 2008. Sample price is 8,000 JPY.

Attachment

PDF Key Specifications [14KB]

---

---

About Fujitsu Microelectronics (FML)
Fujitsu Microelectronics Limited (FML) is a large-scale integrated circuit (LSI) manufacturer that provides highly reliable, optimal solutions to meet the varying needs of its customers, through LSI offerings including ASIC/COT, ASSP and power management ICs, and flash microcontrollers. Along with building on its wide-range expertise focusing on imaging, wireless, and security LSI applications, FML also pursues initiatives for power efficiency and undertakes environmentally-conscious countermeasures. Headquartered in Tokyo, FML was established as a subsidiary of Fujitsu Limited on March 21, 2008. Through its global sales and development network with sites in Japan and other regions in Asia, Europe, and the U.S., FML offers LSI solutions to the global marketplace. For more information: http://jp.fujitsu.com/group/fml/en/

---