2003-0121
Matsushita Electric Component Co., Limited
Fujitsu Interconnect Technologies Limited
Announcing the joint development of a Printed Wiring Board with a new structure in partner ship with Matsushita Electric Components Co., Limited. and Fujitsu Interconnect Technologies, Limited.
| Matsushita Electric Component Co., Limited, President, Koshi Kitadai, (hereinafter referred to as “Matsushita”) and Fujitsu Interconnect Technologies Limited, President Yukichi Takeda, (hereinafter referred to as “FICT”) have reached an agreement on launching the joint development of a new Printed Wiring Board, which is expected to answer the mounting needs of following generation, by integrating “ALIVH(*1)” of Matsushita and “MV-technology(*2)” of FICT. |
January 21, 2003 — This objective is to jointly develop a new Printed Wiring Board, which is achieved by integrating “ALIVH” that has high technical completeness and productivity, and has established evaluation in the cell-phone market as high-density mounting board and “MV-technology” that has been developed in the industrial equipment market such as telecommunication equipment or office computer etc. The business objectives of both companies lie facing in the same direction that they hope to create new business opportunities by advancing a suggestion of new PWB with fresh concept, which leads to the mutual agreement.
New PWB characteristics
| 1. Multilayer PWB with high density Via of multilayer PWB are connected by ALIVH technology. The small through-hole via with higher-density mounting is available for thick boards. |
| 2. Multilayer PWB with flexible connection for all layers Compared to conventional MV multilayer boards, combined use of sequential lamination with MV and ALIVH provides the higher-density of boards (IVH structure in all layers). The flexible connection for multilayer PWB (12 layers or more) is provided. |
| 3. All-layer IVH board that is available for one-time lamination Multilayer PWB (IVH structure in all layers) that is available for one-time lamination by connecting double sided PWBs (via connection) by ALIVH technology. Quick manufacturing and lower price are provided due to reduction of manufacturing process by one-time lamination technology. |
Target
We plan to enter into the infrastructure-based network equipment market (base station, server and router etc,). In addition, we will set out the market that will have increasing attention for high-density mounting such as the semiconductor package market.
Practical application
Sample production in April 2003
Mass production
We aim to supply high-quality products and stable supply from the beginning utilizing both companies’ current production lines and technologies respectively.
Marketing
Both companies will promote sales activities respectively thorough current sales method that each company has developed.
Glossary
- *1 ALIVH:
- Any Layer Inner Via Hole
Innovative Printed Wiring Board with resin (IVH structure in all layers) that is jointly developed by Matsushita Electric Industrial Co., Limited. and Matsushita Electric Components Co., Limited. - *2 MV-technology:
- Multi Via Technology
Multilayer Printed Wiring Board with high density that is jointly developed by Fujitsu Limited, and Fujitsu Laboratories.
High-reliability PWB for high-end segment, which is developed integrating high density build-up technology and high-accuracy sequential lamination technology.
Press Contacts
Shinichi Kashiwaya
Matsushita Electric Component Co., Limited
Network Device Company
Tel: +81-6-6907-4755
Fax: +81-6-6904-4780
E-mail:kasiwaya@dp.maco.mei.co.jp
Keiji Arai
Fujitsu Interconnect Technologies Limited
Development Tel: +81-26-263-2711 Fax: +81-26-259-3823E-mail:arai.keiji@fict.fujitsu.com
Products prices, specifications and services stated in the press release are as of announced date. Since then, we might modify the information about these without an advance notice. Please be forewarned.