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- March 9, 2004
- Develop World's First Multi-layer PCB Capable of 5Gbps Transmission and 4000 Pin Mounting
March 9, 2004 – Fujitsu Laboratories Ltd., Fujitsu Interconnect Technologies Ltd., and Fujitsu Limited today announced the joint development of new manufacturing technologies for large-sized, high-count multi-layer printed circuit boards (PCBs) that enable support of 5Gigabits per second (5Gbps) high-speed transmission and 4000 pin high-density mounting (0.8mm pitch). Fujitsu's new technologies succeed in improving manufacturing yields and significantly reducing production time for high-count multi-layer PCBs. The technologies were developed for use in such areas as next-generation, high-speed servers and telecommunication base station equipment, which demand fast transmission speeds and high-density mounting.
- January 21, 2003
- The joint development of a Printed Wiring Board with a new structure
January 21, 2003 – Matsushita Electric Component Co., Limited and Fujitsu Interconnect Technologies Limited have reached an agreement on launching the joint development of a new Printed Wiring Board, which is expected to answer the mounting needs of following generation, by integrating “ALIVH” of Matsushita and “MV-technology” of FICT.