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FUJITSU INTERCONNECT TECHNOLOGIES

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FC-BGA Substrates (GigaModule)

GigaModule-1,2 -2E

GigaModule-1,2
  • High-density wiring structure, applying Build-up and solid-via plating technology.
  • For High pin-count & High performance substrates, such as MPU, ASIC and Graphic controller for network systems and high-end servers.

GigaModule-4 (Full build-up)

Ultra high density wiring structure

GigaModule-4
  • FICT enables to provide Ultra-Thin & High-density wiring structure, applying core layer free, full build-up, and full stacked-via technology.
  • Reduce layer count by half of conventional technology.
  • For next generation high-end substrate and ultra-thin module.
  • Low inductance property enables GHz bandwidth operation with lower transmission loss.

Features

  GigaModule-1,2 GigaModule-2E GigaModule-4
Structure Build-up + Core Coreless
Stacked via
Material Property
(Build-up)
CTE ≦ 70ppm CTE ≦ 50ppm
Dielectric loss tangent ≦ 0.015
Example
(Feature)
High Pin Count BGA for Large Chip
for Low-k Chip
for Large Chip
for Low-k Chip
Low inductance

Design Rule

[micron]
  GigaModule-1,2 GigaModule-4
Total Thickness 600~1300 220~520
Layer Construction 4~14 4~10
Core Layer
(MIC)
Core Thickness 400~800 -
min Drill Diameter φ150 ( φ100 ) -
min
Line/Space
40 / 40 -
VIA on Pad Usable -
Build-up Layer
(MIC)
Dielectric Thickness 30 or 35
min
Laser Via Diameter
φ60 ( φ40 )
min
Line/Space
20 / 20 ( 15 / 15 )
Stacked VIA Usable
( ) : developing products

Applications

  • Semiconductor package (MPU for server/ASIC/Logic/Graphics)
  • Next generation high-end substrate (Consumer Product)

Construction

GigaModule-2
GigaModule-2 Cross section
Narrow pitch VIA for core
GigaModule-4
GigaModule-4 Cross section
Narrow pitch VIA with full stacked structure



Sales
Tel: +1-408-745-4966
Fax: +1-408-745-4971

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