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FC-BGA Substrates (GigaModule)
GigaModule-1,2 -2E
- High-density wiring structure, applying Build-up and solid-via plating technology.
- For High pin-count & High performance substrates, such as MPU, ASIC and Graphic controller for network systems and high-end servers.
GigaModule-4 (Full build-up)
Ultra high density wiring structure
- FICT enables to provide Ultra-Thin & High-density wiring structure, applying core layer free, full build-up, and full stacked-via technology.
- Reduce layer count by half of conventional technology.
- For next generation high-end substrate and ultra-thin module.
- Low inductance property enables GHz bandwidth operation with lower transmission loss.
Features
| GigaModule-1,2 | GigaModule-2E | GigaModule-4 | |
|---|---|---|---|
| Structure | Build-up + Core | Coreless | |
| Stacked via | |||
| Material Property （Build-up） |
CTE ≦ 70ppm | CTE ≦ 50ppm Dielectric loss tangent ≦ 0.015 |
|
| Example （Feature） |
High Pin Count BGA | for Large Chip for Low-k Chip |
for Large Chip for Low-k Chip Low inductance |
Design Rule
| ［micron］ |
| GigaModule-1,2 | GigaModule-4 | ||
|---|---|---|---|
| Total Thickness | 600～1300 | 220～520 | |
| Layer Construction | 4～14 | 4～10 | |
| Core Layer （MIC） |
Core Thickness | 400～800 | - |
| min Drill Diameter | φ150 （ φ100 ） | - | |
| min Line/Space |
40 / 40 | - | |
| VIA on Pad | Usable | - | |
| Build-up Layer （MIC） |
Dielectric Thickness | 30 or 35 | |
| min Laser Via Diameter |
φ60 （ φ40 ） | ||
| min Line/Space |
20 / 20 （ 15 / 15 ） | ||
| Stacked VIA | Usable | ||
| （ ） : developing products |
Applications
- Semiconductor package (MPU for server/ASIC/Logic/Graphics)
- Next generation high-end substrate (Consumer Product)
Construction
| GigaModule-2 |
|---|
 |
| Narrow pitch VIA for core |
| GigaModule-4 |
|---|
 |
| Narrow pitch VIA with full stacked structure |
Sales
Tel: +1-408-745-4966
Fax: +1-408-745-4971
 |
 Inquiry form |