Burn-in test PCB (Printed Circuit Board)
0.5mm pitch through hole PCB for fine pitch CSP burn-in test applications in mass production.
- SMT type LSI socket can be applied with Via in PAD structure.
- Electroless gold plating provide durability for repeated assembly and repair operation.
- High current burn-in design solution is available by using our simulation capability that can analyze temperature behavior of wiring in the board.
Wiring specification at 0.5mm pitch pad distribution area
| Via pitch : 0.5mm | ［mm］ |
| Type of mounting | Through hole | Filled via | |
|---|---|---|---|
| FIN diameter | φ0.150 | φ0.100 | |
| Drill diameter | φ0.250 | φ0.200 | |
| Surface | Land diameter | φ0.420 | |
| Line width | Layout disabled | ||
| Pad-Line space | Layout disabled | ||
| Inner layer | Land diameter | φ0.450 | |
| Line width | 0.080 | ||
| Pad-Line space | Layout disabled | ||
| Hole-Line space | 0.085 | ||
| relief diameter | 口0.420 | ||
| Solder mask relief diameter of Via in Pad |
Area | ||
| Total thickness （included solder mask） |
t ≦1.6 | 1.6＜ t ＜3.0 | |
- We recommend copper plating or electroless gold plating as the surface finishing.
- In the case of 0.5mm via pitch specification, the through hole structure can be used for board thickness of and under 1.6mm and filled surface via hole structure can be used for board thickness of more than 1.6 mm less than 3.0mm.
Surface
Except the most outsided pads in the 0.5mm pitch pad array, the trace can not be connected to pads on the surface layer.
Inner layer (signaling layer)
When trace is placed between 0.5mm pitch vias, the pad can be placed only the point where the trace connected to via.
Applications
- Burn-in test device
Bob Shaghafi
Tel: +1-408-737-5970
Fax: +1-408-737-5993
E-mail:FICTinfo@fma.fujitsu.com