Buildup PCB (Printed Circuit Board)
Cutting edge HDI technologies
MV(Multi Via) technology ensure high density wiring capacity in the board including.
- Stacked via structure Wiring density improvement
- Filled via plating Packaging density improvement
- Thin down by all layer stacked via structure (MV2E)
Design Rule
| ［mm］ |
| MV2 | MV2 | |||
|---|---|---|---|---|
| Layer Construction | 1-N-1 (N:2 ～ 10) |
2-N-2 (N:2 ～ 10) |
3-N-3 (N:2 ～ 8) |
Max 8 |
| Thickness | - | 0.63 | ||
| Via Diameter | φ0.060 | |||
| Land Diameter | φ0.200 | |||
| Line/Space | 0.050 / 0.050（Inner Layer） | |||
Applications
- PC, Notebook computer
- Mobile-phone, Module (CCD, LAN etc)
- Server for compact audio-video equipment（digital video camera）
Construction
| MV2 (Multi-Via 2) | MV2E (Multi-Via 2 Enhanced) |
|---|---|
|
It's a common buildup structure that build up layer at each side of core layer. It can improve wiring density by stacked via structure on buildup layer. |
It's a lot of flexibility design that can lay out via arbitrarily by all layer stacked via. Building via using a laser on core layer, It follows that higher density wiring and thin thickness (8-layer : 0.63mm). |
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Closeup stacked via |
Closeup all layer stacked via |
Bob Shaghafi
Tel: +1-408-737-5970
Fax: +1-408-737-5993
E-mail:FICTinfo@fma.fujitsu.com