Products & Services
High-end printed circuit boards (ML,MV Family)
With the experience of best part of 40 years in the printed circuit board business field, we have been provide advanced systems with High-performance and High-reliability PCB for network systems and High-end servers.Our new technologies have succeeded in improving manufacturing yields and significantly reducing production lead time for high-count multi-layer PCB and are to be applied for use in such areas as next-generation, high-speed servers and telecommunication base station equipment.
0.5mm pitch through hole PCB for fine pitch CSP burn-in test applications in mass production.
Cutting edge HDI technologies. MV(Multi Via) technology ensure high density wiring capacity in the board including.
Packaging Substrates (GigaModule Family)
FC-BGA Substrates (GigaModule)
FICT enables to provide Ultra-Thin & High-density wiring structure, applying core layer free, full build-up, and full stacked-via technology.