History
There are history of our company from initial until now.
| Dec, | 1967 | Beginning of Multilayer PCB production in Kawasaki-factory |
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| March, | 1972 | Moving PCB production to Nagano-factory |
| Sep, | Beginning of High-density Multilayer PCB (18-layer) production | |
| 1973 | Beginning of PCB production in Kanuma-factory | |
| July, | 1983 | Founding Akashi-factory to mass-produce |
| Feb, | 1985 | Beginning of Large-size High-density Multilayer PCB (42-layer) production |
| Jan, | 1988 | Beginning of High-multilayer ceramic PCB (62-layer) production |
| Dec, | 1993 | Beginning of Multi-chip-module (Thin-film 5-layer) production |
| March, | 1994 | Acquisition ISO9000 certification |
| Sep, | 1995 | Beginning of PCB mounting in Vietnam-factory |
| July, | 1996 | Beginning of PCB production in Vietnam-factory |
| March, | 1997 | Acquisition ISO14001 certification |
| April, | 1999 | Beginning of FC-BGA Substrate (GigaModule) production |
| April, | 2001 | Beginning of Organic Multi-chip-module mass-production |
| Oct, | 2002 | Fujitsu Interconnect Technologies became independence company from Fujitsu Beginning of PCB business |
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| Production) Consolidated production in Nagano-factory and Vietnam-factory Sales) Based in Kawasaki, Kansai, and U.S.A., also Taiwan |
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| Jan, | 2003 | Announcing the joint development of a Printed Wiring Board with a new structure in partner ship with Matsushita Electric Components Co., Limited. | |
| Sep, | Beginning of Probe card for next generation production | ||
| March, | 2004 | Fujitsu Develops World's First Multi-layer PCB Capable of 5Gbps Transmission and 4000 Pin Mounting | |