Testing / Tape & Reel Handler
This is the test and taping machine which directly picks up a product, such as the wafer level CSP (WLP) or CSP product diced on the film frame, conducts visual inspection, electric examination seal inspection, and put them on an embossing career tape.
By exchanging a unit, these products can also be put on the tape according to map information.
Feature
- High speed taping
If electric examination time is less than 1.2 seconds by the double hand, one taping takes 0.7 to 0.8 seconds. - Prevent outflow the inferior device
Visual inspection, characteristic inspection, and taping of device can be performed by one equipment. - Flexibility
Changing device is easy with the direct pickup system. - Damage-less
Any damage to the product is avoided by the direct setup from a wafer ring.
Catalog
PDF Testing / Tape & Reel Handler Catalog (115KB / tsm.pdf)
Contact
Semiconductors System
Tel: +81(0)44-754-2941
Fax: +81(0)44-754-2943
E-mail:fja-semi@cs.jp.fujitsu.com

